Get Introduced to Ceramic Printed Circuit Board

As the substrate used to build this printed circuit board is constructed of ceramic and has uses in specific fields, it is known as a Ceramic PCB. The substrate material for this board is alumina ceramic, and during the manufacturing process, copper is pasted on top of it at a very high temperature. Its substrate material offers extremely high conductivity values, excellent insulating levels, and easy-to-solder surfaces.

The laser-fast metallization technology, a crucial production procedure, is the most popular one. Ceramic borders have a much simpler structure than other types of these boards and provide higher-level activities than other types of boards do. The thickness of the conductive layer utilized in this kind of board ranges from one micrometer to one millimeter.

Ceramics performs two extremely essential functions in these boards: one is about thermal dissipation, and the other is about providing insulation between the circuit layers of the board. Compared to FR-4, ceramic offers superior thermal conductivity and thermal insulation properties.

Visas are required to provide connectivity between the layers on ceramic PCBs that are double or multilayer in nature. Vias are drilled into the ceramic substrate to do this using laser technology.

The copper core is subsequently plated into the drill-holed vias.

Copper Coating
This takes the shape of a thin copper foil that is magnetically sputtered onto the substrate. After connecting the copper foil to the ceramic substrate, the yellow light way's photoresist coating is used to etch the circuit onto the copper.

Dissipative Layer

• Made composed of a variety of components, including phenol and epoxy resins
• The structures of two nearby ceramic substrate layers are joined using it.
• The total thermal conductivity of this board is impacted by the substrate's weak thermal conductivity characteristics when compared to ceramic material.
• The usage of ceramic boards must be restricted to applications with low heat dissipation, it should be noted.

Solder Mask
The exposed copper wires must be protected from solder, metals, and environmental deterioration using. When lamination is complete, the solder mask is put on the top layer of each Ceramic Substrate Board. It might be any color—white, green, beige, red, etc.