IC Substrate Design& Prototyping IC Substrate Manufacturers

IC substrate or known as IC package substrate is a substrate that is used to package bare IC chips. It is the main body of chip packaging and has the properties of high density, high accuracy, high speed, small size, and thinning.

Finally, IC Substrate PCB works as the intermediate product between the chip and the circuit board; for physical-mechanical support of the structures, heat dissipation and protection and to build electrical connections between the chip and the PCB for signal transmission.

This is a member of the carrier family used in both packaging and testing and is used in the majority of the conventional packaging structures including the BGA and the CSP. The main uses of the packaging method involve shielding the exposed chip from the environment, protecting the circuit on the chip from rusting, and establishing a communication point between highly processed chips and low-processed printed circuit boards.

IC substrate definition

IC substrate is a base of semiconductor integrated circuits. Its main purpose is to join several electrical parts in circuit systems. In this context, it establishes a base for more elements within the IC to enhance the typical functionality of the circuit.

C Substrate fabrication technology

How are ic substrates made? Integrated Circuit substrate manufacturing means the interconnection of many circuits on the same board to form a total circuit system.

Circuit functional design, circuit structural design, and layout design are conducted based on circuit design specifications; board size and circuit layers are identified; and further process planning for substrate manufacturing is conducted.

Proofing the circuit board sample designed is to create the sample into a file and imprint the graphics on the file onto the circuit board by means of photolithography to develop a copper pole, for instance.

Printing, the region within the IC Substrate PCB on the graphics made by the photolithography machine is developed to remove unwanted copper, revealing the surface of the glass fiber.

Drilling and drilling machines have to be used in making the holes on the circuit board that will need welding of more components.

Gold plating is the process of covering a layer of metal on the surface of the circuit board via the electroplating process; on one hand, it enhances the conductivity of the product; on the other hand, it discourages oxidation.

Soldering: bond IC chips and all the other components to the respective slots of the circuit board by soldering using hot plates and brackets.

Testing: apply certain electrical and signal checks on the soldered IC Substrate PCB to establish if the electrical performance, signal path, and stability of the circuit board respond to the design requirements.

Packaging: label, clean and pack those circuit boards which have met the company’s requirements in a way that they can be easily transported and stored.

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