IC Substrate Design& Prototyping IC Substrate Manufacturers
IC substrate or known as IC package substrate is a substrate that is used to package bare IC chips. It is the main body of chip packaging and has the properties of high density, high accuracy, high speed, small size, and thinning. Finally, IC Substrate PCB works as the intermediate product between the chip and the circuit board; for physical-mechanical support of the structures, heat dissipation and protection and to build electrical connections between the chip and the PCB for signal transmission. This is a member of the carrier family used in both packaging and testing and is used in the majority of the conventional packaging structures including the BGA and the CSP. The main uses of the packaging method involve shielding the exposed chip from the environment, protecting the circuit on the chip from rusting, and establishing a communication point between highly processed chips and low-processed printed circuit boards. IC substrate definition IC substrate is a base of semicond
